1.0g Syringe Heaksink Compounds for CPU ther Thermal transfer purposes 1.0g Syringe Heaksink Compounds for CPU ther Thermal transfer purposes
1.0G Thermal Compound 1.0G Thermal Compound
1.0G Thermal Compound 1.0G Thermal Compound

1.0g Syringe Heaksink Compounds for CPU ther Thermal transfer purposes

  • Part numberHWC-00880
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What's included

  • What's included

Product Description

1.0g Syringe Heaksink Compounds for CPU ther Thermal transfer purposes


High thermal conductivity low bleed stable.

Thermal coupling of electrical device to heatsinks.

It's perfect for improving the temperature of your CPU or VGA card in your computer and repairing the temperature problem in other devices such as 360 PS etc.

Parameter:

Paste Color:Golden

Net Weight:1g/pc

Gross Weight:3g/pc

Operation Temperature: -50/180

Evaporation: <0.001%
Bleed: <0.05%

Thermal Conductivity:>1.829W/m.k

Thermal Rcsistance:<0.123-in2/w

20% Metal Oxide Compound

  • What's included

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