1.0g Syringe Heatsink Compound for CPU thermal transfer purposes

1.0G Thermal Compound

点击放大图片

1.0g Syringe Heatsink Compounds for CPU thermal transfer purposes


High thermal conductivity, low bleed, stable.

Thermal coupling of electrical devices to heatsinks.

It is perfect for improving the temperature of your CPU or VGA card in your computer and repairing temperature problems in other devices such as 360 PS, etc.

Parameter:

Paste Color: Golden

Net Weight: 1g/pc

Gross Weight: 3g/pc

Operation Temperature: -50/180

Evaporation: <0.001%
Bleed: <0.05%

Thermal Conductivity: >1.829W/m.k

Thermal Resistance: <0.123-in2/w

20% Metal Oxide Compound

资源与参考

尚无可用资源。

文件📁

没有可用的文件。