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1.0g Syringe Heatsink Compounds for CPU thermal transfer purposes
High thermal conductivity, low bleed, stable.
Thermal coupling of electrical devices to heatsinks.
It is perfect for improving the temperature of your CPU or VGA card in your computer and repairing temperature problems in other devices such as 360 PS, etc.
Parameter:
Paste Color: Golden
Net Weight: 1g/pc
Gross Weight: 3g/pc
Operation Temperature: -50/180
Evaporation: <0.001%
Bleed: <0.05%
Thermal Conductivity: >1.829W/m.k
Thermal Resistance: <0.123-in2/w
20% Metal Oxide Compound
Ressources et références
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